Advanced techniques in hybrid assembly of tunable lasers

Semiconductor tunable lasers are employed in different applications due to their small size, low cost, and integrability. Their emissions span the spectrum from the visible range (400-700 nm) up to the mid-infrared range (2.5-10 µm). Hence, they are integral to different applications in the fields o...

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Main Author: Elsayed, Hossameldin
Other Authors: Matemaattis-luonnontieteellinen tiedekunta, Faculty of Sciences, Fysiikan laitos, Department of Physics, Jyväskylän yliopisto, University of Jyväskylä
Format: Master's thesis
Language:eng
Published: 2024
Subjects:
Online Access: https://jyx.jyu.fi/handle/123456789/97124
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author Elsayed, Hossameldin
author2 Matemaattis-luonnontieteellinen tiedekunta Faculty of Sciences Fysiikan laitos Department of Physics Jyväskylän yliopisto University of Jyväskylä
author_facet Elsayed, Hossameldin Matemaattis-luonnontieteellinen tiedekunta Faculty of Sciences Fysiikan laitos Department of Physics Jyväskylän yliopisto University of Jyväskylä Elsayed, Hossameldin Matemaattis-luonnontieteellinen tiedekunta Faculty of Sciences Fysiikan laitos Department of Physics Jyväskylän yliopisto University of Jyväskylä
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description Semiconductor tunable lasers are employed in different applications due to their small size, low cost, and integrability. Their emissions span the spectrum from the visible range (400-700 nm) up to the mid-infrared range (2.5-10 µm). Hence, they are integral to different applications in the fields of communication, sensing, medicine, and spectroscopy. However, realizing high-performance integrated tunable lasers is very challenging. For example, the hybrid integration of different photonic devices usually suffers from misalignment, low coupling efficiency, and long-term instability. In this work, a hybrid integrated tunable laser high performance was demonstrated through UV-curable adhesive assembly. The study presents the usage of UV-curable adhesives and their role in realizing a robust and stable hybrid integration of GaSb-based reflective semiconductor optical amplifiers (RSOA) and Si3N4 photonic integrated circuits (PICs). It includes designing a semi-automated assembly process, conducting experiments to characterize the adhesives, and characterizing the hybrid laser. The assembled hybrid tunable laser achieved a maximum output power of 7.7 mW with a current threshold of 117 mA. In addition, wavelength emission at 1984 nm with tuning of 0.1 nm was demonstrated. These findings contribute to the advancement of reliable and efficient hybrid integration techniques for photonic devices.
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spellingShingle Elsayed, Hossameldin Advanced techniques in hybrid assembly of tunable lasers tunable lasers hybrid integration UV-curable adhesives PICs Soveltava fysiikka Applied Physics 4023 laserit lasertekniikka puolijohteet optiikka lasers laser technology semiconductors optics
title Advanced techniques in hybrid assembly of tunable lasers
title_full Advanced techniques in hybrid assembly of tunable lasers
title_fullStr Advanced techniques in hybrid assembly of tunable lasers Advanced techniques in hybrid assembly of tunable lasers
title_full_unstemmed Advanced techniques in hybrid assembly of tunable lasers Advanced techniques in hybrid assembly of tunable lasers
title_short Advanced techniques in hybrid assembly of tunable lasers
title_sort advanced techniques in hybrid assembly of tunable lasers
title_txtP Advanced techniques in hybrid assembly of tunable lasers
topic tunable lasers hybrid integration UV-curable adhesives PICs Soveltava fysiikka Applied Physics 4023 laserit lasertekniikka puolijohteet optiikka lasers laser technology semiconductors optics
topic_facet 4023 Applied Physics PICs Soveltava fysiikka UV-curable adhesives hybrid integration laser technology laserit lasers lasertekniikka optics optiikka puolijohteet semiconductors tunable lasers
url https://jyx.jyu.fi/handle/123456789/97124 http://www.urn.fi/URN:NBN:fi:jyu-202409206001
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